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Center for Nano-MicroManufacturing
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Center for Nano-MicroManufacturing

Providing researchers with micro-nanofabrication technologies, processes, and services
  • UC Davis

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  • About Us
    • CNM2 Team Contact Info
    • Location and Parking Information
    • User Meetings
    • CNM2 Publications
    • Cleanroom Video Tour
  • Getting Started
    • Internal UC Access Procedure
    • External Non UC Access Procedure
    • Facility Usage Rates
    • Badger Lab Management Software
    • Service Request Procedures
  • Safety
    • SDS/SOP Table
    • CNM2 Policies and Procedures
    • Chemical Directory
    • Request approval of non-stock chemical
    • Cleanroom Map
    • UC Davis Chemical Hygiene Plan
  • Equipment
    • Lithography
      • GCA 8500 i-line Stepper
      • EVG 620-mask aligner
      • Karl Suss MA4 1 & 2
      • Brewer Photoresist Spinners 1 & 2
      • Solitec Photoresist Spinners 1 & 2
      • CEE 100 Spinner
      • NPGS Electron Beam Lithography
      • Sky 335R6 Heated-Roller Laminator
    • Etch
      • PlasmaTherm Apex SLR RIE/ICP
      • PlasmaTherm Apex SLR RIE
      • PlasmaTherm Versaline DSE
      • PlasmaTherm Vision 320 RIE
      • IntlVac Nanoquest IBE/RIBE/CAIBE
      • Xactix XeF2 Etcher
      • PETS RIE
      • DPSS Laser
      • Idonus HF Vapor Etch
      • Yield Engineering Systems G500 O2 Plasma Etcher
    • Thin Film Deposition
      • IntlVac Nanochrome I Ebeam/Thermal Evaporator
      • CHA E-beam Evaporator
      • Lesker Labline Sputter System
      • Picosun R-200 PEALD
      • PlasmaTherm Versaline HDPCVD
      • PlasmaTherm Vision 310 PECVD
      • Quorum Tech Gold/Carbon Sputter Coater
    • Metrology
      • J.A. Woollam M-2000 Ellipsometer
      • Bruker Dektak XT
      • Nanometrics Nanospec
      • 4 point probe
      • Dektak 3ST
      • HP 4155A and Probe Station
    • Microscopy and Analysis
      • FEI Scios Dualbeam FIB/SEM
      • FEI Nova NanoSEM 430
      • Nikon TMS Infrared Microscope
      • Carl Zeiss Axiotron Microscope
    • Cleaning and Preparation
      • Nitrogen Glove Box
      • Semitool Spin Rinser
      • Ultra T SCSx124 Substrate Cleaning System
    • Packaging
      • EVG 501 Wafer Bonder
      • EVG 810 Plasma Activation
      • Disco DAD 321 Dicing Saw
      • Tousimis AutoSamdri 815 Critical Point Dryer
      • Nordson DAGE 4000 Bond Tester System
      • West Bond 7700E Wire Bonder
    • Thermal Processing
      • Allwin AW610 Rapid Thermal Processor
      • Annealsys As-One RTP
      • Programmable Oven
  • Training
    • Access to CNM2 Equipment
    • Training Charges Explained
    • Equipment Basic Training
    • Equipment Specialized Training
    • General Training and Short Courses
  • Process
    • Photo and EBL Resists Provided
    • Photolithography and EBL Baseline Recipes
    • Process Monitors
    • Materials Provided
    • General Chemicals Provided
    • Process Notes
  • Contact Us
    • CNM2 Publications
Breadcrumb
  1. Center for Nano-MicroManufacturing
  2. Process
  3. Photo and Ebeam Lithography Baseline Recipes

In order to help CNM2 members get started with their photolithography processing, we have developed baseline recipes on the instrumentation below.  Click the links below to have a look at baseline recipes for each photoresist.

EVG620 Mask Aligner 

  • KL5302 200nm
  • NR7-1500P 1um
  • NR9-1500PY 2um
  • NR77 1500PY 1.5um
  • NR78-8000P 18um
  • PR1-1000A1 1um
  • PR1-4000A1 4um
  • S1813 2um 

GCA 8500 i-line Wafer Stepper

  • KL5302 200nm
  • NR7-1500P 1um
  • NR9-1500PY 2um
  • PR1-1000A1 1um
  • PR1-4000A1 3um

NPGS EBL

  • Sub 30nm lines and dots metal lift off

Sub Main Menu

  • Photo and EBL Resists Provided
  • Photolithography and EBL Baseline Recipes
  • Process Monitors
  • Materials Provided
  • General Chemicals Provided
  • Process Notes

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  • Last update: March 31, 2022

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Center for Nano MicroManufacturing   |   1209 Kemper Hall   |   530-752-9831

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