Center for Nano-MicroManufacturing

Wafer Bonding

• Glass to glass fusion bonding

Photoresist Processing

• Lift-off process
• Spin Coating
• Softbake
• Photoresist Optical Parameters
• Photoresist baking
• Photoresist coating
• Hardbake
• Exposure

Process Notes

• Notes for Troubleshooting Alignments
• MEMS_runsheet
• PlasmaThermRecipes
• Versaline HDPCVD and VIsion 310 PECVD FAT results, Oct 2018

Measurement Results

• Winter 2019 EEC246A Measurement results
• EEC146A Electrical Characterization Measurements (Updated on Dec 11, 2015)
• Fall 2015 EEC146A Measurement results
• Spring 2017 EEC146A Measurement results

Photoresist Adhesion

• Substrate Cleaning and Adhesion
• Resist Adhesion
• Process Startup and Optimization

Development

• Solvents
• Resists Developer Removers
• Photoresist Removal
• Development Photoresist

Fabrication Notes

• Lithography Trouble-shooting
• Lift-off
• Reflow
• Grey-scale Lithography

Photoresist Information

• Photoresist Storage Aging, Refilling, and Dilution
• High-Resolution Photoresist Processing
• Photoresist Rehydration
• General Properties of AZ/TI Photoresists

Etching

• Wet Chemical Etching
• HF Etching
• Gold Etching
• Dry Etching Photoresist
• Aluminum Etching
• Chromium Etching
• Silicon Etching

Specialty Photoresist Information

• Laser Exposure of Photoresists
• Electroplating Photoresists
• AZ nLOF 20xx Negative Resist
• Image Reversal Resists
• Spray Coating Resist