Advanced Vacuum’s APEX SLR provides etching capabilities over a variety of materials and substrates. This system utilizes Cl2, BCl3, Ar and O2 process gasses to accommodate a large variety of dry etch process capabilities. Historically the tool has been used to etch III-V materials, and various oxides. System can accommodate sample sizes ranging from full 6" wafers to odd size parts and pieces.  Samples other than 6" wafers are mounted on a 6" carrier wafer.

Metal etches and material compatibility need to be discussed with staff. Exposed Gold and other potential sources of mobile ion contamination are not allowed in the chamber.