The Vision 310 PECVD is a fundamental deposition system for semiconductor fabrication and material science facilities. Used in R&D and low volume production applications, the classic parallel plate configuration provides a wide range of high quality, uniform films. Simple installation and operation, reliable hardware and software suite, coupled with a small footprint, make the Vision 310 PECVD the most cost effective turnkey solution in its class. This system utilizes SiH4, NH3, N2 and N2O process gasses and low frequency and high frequency RF power generators to accommodate a large variety of PECVD process capabilities including low stress silicon nitride deposition.
PlasmaTherm Vision 310 PECVD