CHA Ebeam

Used for depositing films of metals, oxides, nitrides and semiconductors, the CHA E-Beam Evaporator is the ideal tool for lift-off-layer patterning of most thin films. By design, it can evaporate up to 6 different materials in a single vacuum, which together with its low base pressure allows users to create metal stacks with non-ohmic contact between the layers. Materials can be deposited up to 1.5 um in thickness and many materials are available to evaporate.  The CHA E-Beam Evaporator has space for 18 4" wafers in its rotating planetaries, and has sample holders for chips. Crucible size for the pockets in our E-beam: Volume-15cc, Top Dia - 1.48", Height - 0.67".