Used for depositing films of metals, oxides, nitrides and semiconductors, the CHA E-Beam Evaporator is the ideal tool for lift-off-layer patterning of most thin films. By design, it can evaporate up to 6 different materials in a single vacuum, which together with its low base pressure allows users to create metal stacks with non-ohmic contact between the layers. Materials can be deposited up to 1.5 um in thickness and many materials are available to evaporate. The CHA E-Beam Evaporator lift off dome can hold five150mm wafers and the planetary sample holder (conformal deposition) has space for up to 18 100mm wafers. Both wafer holders can be used for small or odd shaped pieces. Crucible size for the pockets in our E-beam: Volume-15cc, Top Dia - 1.48", Height - 0.67".