Purpose built to sputter deposit thin films with superb reproducibility, the Lesker Labline Sputter System uses four primary guns to sputter, or co sputter, up to four materials in a single vacuum. It uses both standard and magnetron guns to allow users to deposit a wide range of materials and uses MFC controlled gas flow for reactive sputtering. The Lesker sputter can accommodate samples ranging in size from small pieces up to six inch wafers. The rotating sample stage maximizes uniformity, and can be heated up to 800C.  RF bias applied to the stage provides plasma cleaning capability to remove native oxide and/or organics prior to deposition to allow the cleanest possible interfaces. Its load lock system allows for higher reproducibility and shorter pump down times. It also has a modern touch-screen control, which allows users to run and share recipes.