Plasma-Therm’s VERSALINE HDPCVD product is a new approach to achieving highly dense and conformal films at low substrate temperatures. The system utilizes a high-density ICP plasma with a temperature-controlled and biased substrate. Uniform gas injection at the substrate level maximizes film quality. This system utilizes SiH4, N2, O2, CH4 and Ar process gasses to accommodate a large variety of PECVD capabilities including silicon dioxide, silicon nitride, silicon oxy-nitride and amorphous silicon.
PlasmaTherm Versaline HDPCVD