The POLI-500 CMP delivers production-quality process capability coupled with reliability and ease of use.  The POLI-500 uses 200mm, 150mm and 100mm wafer carriers and can be equipped to process smaller substrates and coupons.  The Poly 500 utilizes an intuitive user interface and a robust PLC control system that includes the multiple process steps and detailed process controls required for advanced CMP processing.  Processes developed using the POLI-500 closely resemble production processes for planarization and ultra flat surfaces.