Location
1224A3
Contact
Using KLA-Tencor’s patented “Dual Wavelength” technology, the Toho FLX 2000-A determine and analyze surface stress caused by deposited thin films. The analysis software displays any combination of stress, time, surface deflection, or reflected light intensity measurements. In general, stress is induced when materials of dissimilar coefficients of thermal expansion are bonded together. Films may behave similarly at high temperatures but as films are cooled, materials may contract/expand differently, thus causing stress in the film. With a stressed film, defects such as dislocations, voids, and cracking may occur. The FLX 2000-A enables the following:
- Calculation of biaxial modulus of elasticity, linear expansion coefficient, stress uniformity, and file subtraction
- Trend plotting for Statistical Process Control (SPC)
- Automatic recalculation of stress when film or substrate thickness is corrected