EVG 501 Wafer Bonder

Bonder
Location
1274
Contact
  • C-controlled operating environment
  • Accommodates small pieces up to 150 mm wafers
  • Top and bottom side heaters
  • High vacuum capability bond chamber
  • Can perform the following bonds:
    • Direct bonding
    • Anodic Bonding
    • Thermo-compression bonding

EVG