Yield Engineering Systems G500 O2/Ar Plasma Etcher

YES G500

The YES-G500 uses capacitive plasma generation. Plasma is generated between pairs of planar electrodes that are electrically “active” or are electrically grounded. Active electrodes are at the potential of the RF power that is supplied to the tool.

A variety of available plasma exposure modes such as downstream plasma, active plasma, RIE plasma, active ion trap plasma and grounded ion trap plasma can be utilized via the shelf system in the YES G500 plasma chamber.  The shelf sequence can be adjusted to enable control of the substrate potential and the energy level of the electrons and ions that come in contact with the substrate.