Quick and readily approachable for new users, the Technics RIE is NCNCâs primary tool for thin film plasma etches. It supports O2, CF4, SF6 and Ar to allow convenient descumming and etching of Silicon, Silicon Oxide and Silicon Nitride as well as several metals and compound semiconductors. The chamber is large enough to accommodate up to three 4 inch wafers during an etch, though it's also convenient to use on single chips. Alternatives for reactive ion etching include the PlasmaTherm RIE and the Oxford DRIE.
Model: Micro-RIE Series 800Manufacturer: TechnicsLocation: 1224A6RATESÂ | Operation Manual