Technics PECVD

Technics PECVD 1Model: Micro PD Series 900

Manufacturer: Technics

Location: 1224A2

RATES | Operation Manual

Designed with small-batch processing in mind, the Technics PECVD can deposit up to several hundred nanometers of Silicon Oxide, Silicon Nitride, and Silicon OxyNitride for use as hardmasks, insulation layers and gates. The tool is designed to support high-temperature (~350 °C) processing on up to three or four wafers in a run.

Alternatives for thin film deposition include the CHA E-Beam Evaporator, the Lesker Sputterer, the CHA Sputterer and the CHA Thermal Evaporator.