The PlasmaTherm etcher is a reactive ion etcher designed for excellent selectivity and verticality in etching Silicon Nitride, though it can also etch Silicon Oxide. Itâs designed with a recipe based user interface to allow higher reproducibility than other laboratory etchers. The chamber is large enough to accommodate three 4 inch wafers during an etch, and the tool is plumbed with CF4, O2 and Ar. Only Silicon, Silicon Oxide, Silicon Nitride and Photoresist are allowed in the tool. Alternatives for reactive ion etching include the Technics RIEÂ and the AlcatelÂ DRIE.
Model: 790 SeriesManufacturer: PlasmaThermLocation: 1224A2RATESÂ | Operation Manual