EVG 810 Plasma Activation

Model: 810Manufacture: EVGLocation:1274Rate | ManualThe Plasma Activation Module enables surface plasma activation of the wafer prior to bonding (fusion/molecular and intermediate layer bonding). This method allows the final annealing temperature to be decreased from > 1000º C (in the case of non-activated surfaces) down to < 400º C. The available process gases are nitrogen and oxygen.There are no alternative for this equipment.