EVG 501 Wafer Bonder

Model: EVG 501Manufacturer: EVGLocation: 1274

     

  • PC-controlled operating environment
  • Can handle wafers up 150 mm.
  • Top and bottom side heaters
  • High vacuum capability bond chamber
  • Can perform the following bonds:
    • Direct bonding
    • Anodic Bonding
    • Thermo-compression bonding
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