RATESÂ | Operation Manual
Great for thermal bonding, the EVG 501 is used to bond 4" silicon wafers. Patterned wafers can be pre-aligned in the EVG 420 Mask Aligner using a special fixture. This fixture facilitates precise registration of two wafers in the aligner prior to using the EVG 501 Wafer Bonder. Once the wafers are aligned, the fixture is moved to the bonding station.