Alcatel DRIE

Alcatel DRIEModel: 601E

Manufacturer: Alcatel

Location: 1224B3

RATES | Operation Manual

The 
Alcatel
 601E
 utilizes
 the 
Bosch 
process 
to 
provide 
deep 
etches 
into 
silicon
substrates. With 
proper
 substrate 
preparation 
and 
handling 
the 
system 
can completely 
etch 
through a 
silicon wafer. The current 
configuration 
is 
for 
100 
mm
 silicon wafers 
with 
a 
single 
flat. 
After 
a substrate 
has 
been 
manually 
loaded 
into 
the loadlock, 
all 
transfer 
and 
processing 
is completed 
under 
automatic
 computer control.