Currently Offered Courses
EEC 146A:Â Integrated Circuits Fabrication (3)
Lectureâ2 hours; laboratoryâ3 hours. Prerequisite: course 140B. Basic fabrication processes for Metal Oxide Semiconductor (MOS) integrated circuits. Laboratory assignments covering oxidation, photolithography, impurity diffusion, metallization, wet chemical etching, and characterization work together in producing metal-gate PMOS test chips which will undergo parametric and functional testing. GE credit: SciEngÂ |Â SE.âF. (F.)
EEC 146B:Â Advanced Integrated Circuits Fabrication (3)
Lectureâ2 hours; laboratoryâ3 hours. Prerequisite: course 146A. Restricted to Electrical, Computer, and Electrical/Materials Science majors and Electrical Engineering graduate students. Non-majors accommodated when space available. Fabrication processes for CMOS VLSI. Laboratory projects examine deposition of thin films, ion implantation, process simulation, anisotropic plasma etching, sputter metallization, and C-V analysis. Topics include isolation, projection alignment, epilayer growth, thin gate oxidation, and rapid thermal annealing. GE credit:Â SciEngÂ |Â SE.âW. (W.)
EEC 246: Â Advanced Projects in IC Fabrication (3)
Discussionâ1 hour; laboratoryâ6 hours. Prerequisite: course 146B. Individualized projects in the fabrication of analog or digital integrated circuits. Offered in alternate years.âW.
Phy 250-1: Nanofabrication and Properties of Artificially Structured Materials (3)
Taught by Professor Kai Lu of Physics, Phy250-1 includes an in-the-cleanroom demonstration of photolithography with explanations of deposition, etch and characterization. This 3 unit course is intended to introduce graduate students to state-of-the-art nanofabrication techniques and physical properties of magnetic nanostructures. Particular emphasis will be put on those techniques available on campus. First, various types of nanofabrication techniques, their capabilities and limitations in achieving magnetic nanostructures, will be discussed. Specifically, I will cover physical and chemical deposition (vacuum basics, sputtering, evaporation, MBE, pulsed laser deposition, electrodeposition) and nanopatterning techniques (photo- and e-beam lithography, x-ray lithography, laser interference lithography, scanning probe lithography, step growth methods, nanoimprint, shadow masks, radiation damage, self-assembled structures, and the use of nanotemplates).Â Then the course reviews the common methods for structural, chemical, and magnetic characterizations (x-ray and electron diffraction, electron microscopy, EDX, SQUID, VSM, AGM).Â Physical properties of these nanostructures will be discussed, including properties of single nanodots, magnetic interactions in arrays, magnetic behavior of nanostructured wires, magneto-transport phenomena, and properties of hybrid systems. Some lab demonstrations and/or experiments will be included.
BIM118:Â Microelectromechanical Systems (4)
Lectureâ2 hours; laboratoryâ3 hours; discussionâ1 hour. Prerequisite: Chemistry 2A; Engineering 17. Restricted to upper division standing in College of Engineering. One restricted to upper division standing in Biomedical Engineering. Introduction to the theory and practice of micro-electromechanical systems (MEMS), including fundamentals of micro-nanofabrication, microscale sensing and actuation, self assembly, microfluidics and lab-on-a-chip. Weekly hands-on laboratory sections are emphasized on implementation and utilization of MEMS technologies. GE credit: SciEngÂ |Â SE.âS. (S.)Â PanProgramsDepending on the group size, these tours often include a short Photolithography demonstration or hands-on PDMS demonstrations.